Option (2) might allow users to mount accessories on top of the heatsink in the future…whereas Option (1) may look more aesthetically pleasing. Note: These are CNC-machined samples, so you can see some defects in the high resolution images.
For HTPC use and most industrial applications a passive heatsink is better (quieter and nothing to go wrong electrically or mechnically) so IMHO it would be better to ship a heatsink with larger fins that cover the width of the board (not 50%).
It will be very good if you make the USB ports double (now they are single). This will increase the overall height of the Board and can increase the height of the radiator fins.
And turn the 40-pin connector over to the bottom side of the Board.
Personally, I’m thinking that if the 40-pin GPIO is put on the underside of the board, then that creates space for a wider (not necessarily taller) passively cooled heatsink on the top.
After my investigations in this thread, I’m quite convinced that the VIM2, at least can be passively cooled rather effectively (even with the VIM Heatsink), at an ambient temperature of about 23C.
Of course, placing anything above the heatsink obstructing the convective air flow, will render passive cooling infeasible…
Some Thoughts:
A large aluminium heatsink may be more expensive to manufacture.
Some people may consider it ugly.
From my design background, I know its possible to make these things look cool.
It is possible to combine functions of the top (metal) cover of the case and a radiator. You can use the entire top cover as a large passive cooling radiator.
Nice sandwich, what video quality are you talking about?
I only have a stock radiator, with a high load on the processor, it also does not rise above 60 °