Hi, I’m trying to assemble the VIM3, I got it with the new heat sink, the extension board (m2) and the DIY case.
I noticed right away that the case is not compatible with the new M2X extension board, is that right? or is there a way to make it work?
Also the heat sink came with two thermal pads, a pink one and a light blue one, which one should I use? or should both be used? if so where should they be placed? (I assume that the light blue one should go over the main chip sin it looks thicker, but what about the pink one?)
@RDFTKV the rk3399 is a taller SoC with the metal IHS protruding a bit higher than the silicon die itself, so clearance is probably the more appropriate reason, and I can also assure the edge-v’s thermal pad has better thermal performance of the latter being thinner and having equivalent thermal conductivity, resulting in better conductance