Dear Khadas team,
whereas the Mind 2 is a great product, there is quite some audible noise at a CPU usage of 20-25% (all drivers are updated; I run the Mind 2 in energy saver mode.)
Is there a software to influence fan speed (at one’s own risk)? (I tried FanControl, but it does not work.) or do you plan an update to reduce noise levels / allow finetuning oneself?
And how does the noise level of the Mind 2s compare to the Mind 2?
Thank you.
Still waiting for a reply from the Khadas team …
Apologies for the delayed response. There are currently no plans to enable CPU fan adjustments. The fan speed is determined by the temperature of the Mind CPU. When the CPU operates, lower fan speeds could lead to heat accumulation, which might compromise the stability of Mind’s performance. Therefore, we are unable to grant this adjustment permission at the moment. However, future products may include this feature. Thank you for your feedback.
Additionally, we’d like to mention that both Mind 2s and Mind2 share the same fan speed control strategy. The Mind 2s model was officially released on February 14th.
Thank you for your reply.
For me, the noise issue is the major limitation of the Mind.
Otherwise, it is a great system.
買一個手機用的主動式 PN 半導體致冷風扇放在 Mind 上面，整個 Mind 機身可以降溫至其內置風扇也以最慢的轉速運作。
謝謝你的建議，我會試試看！ 
謝謝你的建議！我很驚訝這麼小的元件竟然能夠達到這樣的效果。我在網上也找到類似的產品，打算訂購一個來試試看。
Can you share some information on the cooler itself? What material is the heat sink on top of the CPU made of?
I know that you use a Phase Change Termal Pad between the CPU and heatsink but I’d like to change it to somehing like a Coollaboratory Liquid MetalPad which I used in older PC builds. That should at least bring temps down to approx. -5°C compared to the current solution.
The radiator adopts a vapor chamber + fin design, with both components made of copper. The vapor chamber is vacuum-sealed and filled with liquid internally. Liquid metal thermal interface material (TIM) must not be used between the CPU and the cooler, as prolonged usage could corrode the cooler and cause rupture/failure of the vapor chamber
Since the cooler is made of copper and not aluminum, it’s not gonna have any corrosion when used with the Coollaboratory Liquid Metal Pad. The pad itself is not liquid as other liquid metal solutions that can introduce corrosion. Obviously with aluminum both variants won’t work.
But then it should be no problem using the Coollaboratory Liquid Metal Pad.
Here the product link I was talking about.
https://www.coollaboratory.com/product/coollaboratory-liquid-metalpad/
@Zihao.Chen I was trying to find a picture of the cooler and found this:
The radiator design was revised starting from the late Mind1 production phase. For Mind2, we transitioned to a non-nickel-plated version and replaced the thermal interface material with phase change material (PCM) sheets, respectively.
Can you share a screenshot of the new cooler design?
Thank you for the quick reply.
So from my perspective the Coollaboratory Liquid MetalPad can still be used in this situation. Since the cooler is of bare copper and not nickel-plated it will react will the Gallium component of the Liquid MetalPad but it’s minimally into the first copper layer over many months (diffusion) and typically does not result in any thermal disadvantages.
Most importantly, it will not decompose the copper like it would with aluminum.
A slight surface discoloration or matting of the copper can/will occur over a very long period of time, but no decomposition as with aluminum.
I think it’s woth a try 
Could Khadas try this internally? Applying the pad and doing a propper burn-in process should be pretty easy on this device.
I will pass along this information to the colleague in charge of thermal management and really appreciate your feedback
